Business Wire

DeGirum Rolls Out ORCA Edge AI Accelerator Production Samples in ASIC and M.2 Module Formats, with Production Volume Ramp in October

SANTA CLARA, Calif.--(BUSINESS WIRE)--DeGirum Corp, a pioneer in Edge AI HW & SW solutions, is thrilled to announce the immediate availability of its ORCA (Edge AI Accelerator) production samples in ...
Finanznachrichten

Alpha and Omega Semiconductor Limited: Alpha and Omega Semiconductor Announces Expanded Surface Mount and Module Package Options for its 1200V aSiC MOSFETs

Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, ...
Financial Post

New Credo 3.2Tbps DSP Connectivity Chiplet with 56Gbps Lane Rates to Accelerate Time-to-Market for New Multi-chip Module ASICs

BlueJay Retimer Chiplet with Credo’s Advanced Mixed-Signal DSP Technology Enables High-Performance, Low-Power Solutions for Advanced Switching, Compute, AI, and Machine Learning Devices SAN JOSE, ...
Design-Reuse

VeriSilicon Shipping ZSP Based ASIC for SyChip's Voice Over WLAN Module

SANTA CLARA, Calif. -- Aug. 8, 2006-- VeriSilicon, a leading world class ASIC design foundry and semiconductor IP provider focusing on design and manufacturing services for customers worldwide, today ...
it.tmcnet

HP Adopts QLogic's Fibre Channel over Ethernet ASIC Chip for FlexFabric Module

Hewlett-Packard (News - Alert) (HP) has adopted the new Fibre Channel over Ethernet (FCoE) application-specific IC (ASIC) chip from Qlogic (www.qlogic.com) for its Virtual Connect FlexFabric ...
Business Wire

OIF Approves CEI-224G Development Project, Reviews Co-packaging of Optics with ASICs Workshop, Announces Optical Module Management Interface Survey Results at Q3 Meeting

FREMONT, Calif.--(BUSINESS WIRE)--OIF members continued to drive industry interoperability efforts forward during the Q3 2020 Technical and MA&E Committees Meeting, held August 3-7. This quarter’s ...