TL;DR: Intel and SoftBank unveiled next-generation ZAM memory prototypes featuring a unique Z-angle interconnect architecture that improves thermal management and reduces power consumption by 40-50%.
Use left and right arrow keys to seek audio. Intel is re-entering the memory business, teaming with Japan's SoftBank on a next-generation DRAM bonding technology. Intel's Next-Generation DRAM Bonding ...
The commercial adoption of DDR5 started in 2021 as it slowly became the new standard, and now the industry is already working on what comes next. According to TheElec, Samsung Electronics, SK Hynix, ...
Samsung Electronics stock gained on Monday following a report that it will start large-scale production of the next generation of high-bandwidth memory chips as soon as this month. That lays down a ...
JEDEC is pushing server memory even faster with its next-generation DDR5 MRDIMM roadmap, and no, this probably isn't the kind of RAM you'll be dropping into your next gaming PC. The standards body ...
SANTA CLARA, Calif., March 10, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it is working with Micron Technology to develop next-generation DRAM, high-bandwidth memory (HBM) and ...
GameSpot may receive revenue from affiliate and advertising partnerships for sharing this content and from purchases through links. Like all of your favorite pieces of technology, the next-generation ...
Samsung shares rose after it shipped samples of its newest AI memory chip. The chipmaker said HBM4E was faster than its previous HBM4 products. The launch comes as Samsung pushes to gain ground in ...
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